Posted Date : March 08,2019
Product (RFP/RFQ/RFI/Solicitation/Tender/Bid Etc.) ID : SW-22481
Government Authority located in Connecticut; USA based organization looking for physical vapor deposition system.
[A] Budget: Looking for proposal
[B] Scope of Service:
(1) Vendor needs to provide physical vapor deposition system shall consist of two chambers installed side-by-side for sputtering and evaporation deposition, system requirements for each chamber:
- 200 mm single wafer
- Substrate rotation
- Pneumatically actuated substrate shutter
- Film thickness control
- Uniformity better than 3.5% across 200 mm substrate
- Minimum of 1250 l/s turbo pump
- Removable chamber liners
- Baseline pressure of less than 5x10-7 Torr
- Minimum 6-pocket e-beam source
- Minimum 2 thermal evaporation boats
- Co-evaporation capability
- Installed magnetron sputtering targets with 3” or 4” diameter, confocal configured with
installed targets of Ge, Sb, Te, Ge2Sb2Te5, SiO2, Ti
- Substrate DC and RF bias
- Load lock for 4”,5”, 6” and 8” substrates
- Ellipsometer ports for in-situ ellipsometry
- 2 Pulsed DC 2kW or more and 2 RF sources 300 W or more
- Automatic RF-matching network and controller
- Throttle valve on pump line for pressure tuning
- 2 multi-position RF / DC switches
- O2, N2 and Ar gas lines with corresponding mass flow controllers max. flow 100 sccm
- 3rd Pulsed DC 2kW or more source
- 3rd RF source 300 W or more
- Integrated ellipsometer for film thickness measurements, film sense FS-1 or similar
(2) All written questions must be submitted no later than March 19, 2019.
[C] Eligibility:
Onshore (USA Only)
[D] Work Performance:
Performance of the work will be Offsite. Vendor needs to carry work in their office premises.
Budget :
Deadline to Submit Proposals: March 27,2019
Cost to Download This RFP/RFQ/RFI/Solicitation/Tender/Bid Document : 5 US$
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Product (RFP/RFQ/RFI/Solicitation/Tender/Bid Etc.) ID : SW-22481
Government Authority located in Connecticut; USA based organization looking for physical vapor deposition system.
[A] Budget: Looking for proposal
[B] Scope of Service:
(1) Vendor needs to provide physical vapor deposition system shall consist of two chambers installed side-by-side for sputtering and evaporation deposition, system requirements for each chamber:
- 200 mm single wafer
- Substrate rotation
- Pneumatically actuated substrate shutter
- Film thickness control
- Uniformity better than 3.5% across 200 mm substrate
- Minimum of 1250 l/s turbo pump
- Removable chamber liners
- Baseline pressure of less than 5x10-7 Torr
- Minimum 6-pocket e-beam source
- Minimum 2 thermal evaporation boats
- Co-evaporation capability
- Installed magnetron sputtering targets with 3” or 4” diameter, confocal configured with
installed targets of Ge, Sb, Te, Ge2Sb2Te5, SiO2, Ti
- Substrate DC and RF bias
- Load lock for 4”,5”, 6” and 8” substrates
- Ellipsometer ports for in-situ ellipsometry
- 2 Pulsed DC 2kW or more and 2 RF sources 300 W or more
- Automatic RF-matching network and controller
- Throttle valve on pump line for pressure tuning
- 2 multi-position RF / DC switches
- O2, N2 and Ar gas lines with corresponding mass flow controllers max. flow 100 sccm
- 3rd Pulsed DC 2kW or more source
- 3rd RF source 300 W or more
- Integrated ellipsometer for film thickness measurements, film sense FS-1 or similar
(2) All written questions must be submitted no later than March 19, 2019.
[C] Eligibility:
Onshore (USA Only)
[D] Work Performance:
Performance of the work will be Offsite. Vendor needs to carry work in their office premises.
Budget :
Deadline to Submit Proposals: March 27,2019
Cost to Download This RFP/RFQ/RFI/Solicitation/Tender/Bid Document : 5 US$